Numerical Investigation of Debonding on Piezoelastic System using Coupled Field Analysis

Abstract

For the past few years, along with the increasing population growth the demand for the Civil Engineering structures has increased drastically. For safety and serviceability requirement the performance of these structures must be monitored periodically. Structural Health Monitoring (SHM) provides best periodic checks for measuring or sensing the response by using different types of smart materials which responds to different parameters like stress, magnetic field, electric field, heat etc. In general, EMI signature depends on the adhesive that is used to glue the PZT patch and the host structure. Any change in adhesive material might also be a cause for the deflections in the overall signature as the stress transfer occurs through the bonding layer. This paper aims to investigate the de-bonding effect of adhesive layer on the efficiency of damage detection of PZT when bonded to structure to be monitored. The Finite element (FE) coupled analysis for smart structural system i.e for aluminium beam attached to PZT patch with adhesive bond with different de-bonding geometry. The numerical results are compared with the results of perfect bonding condition to highlight the efficiency of developed model.